PET Release Film UV Dicing Tape

Description

UV Dicing Tape was once single covered with exclusive adhesive which has excessive adhesion. With this tape, the wafer would now not fall off or fly off in the course of grinding and dicing.The tape is designed for deep-cutting process of LED modules, chips, camera modules.Mainly used for the package dicing of all kinds of IC wafers.

Feature

Strong Adhesion before UV Irradiation

Easy Peel-off after UV Irradiation

Various Line-up for Special Application such as Glass, Wafer with Metal etc…

Thickness

0.02~0.2mm

Material

PO or PVC

Viscosity removal method

Need ultraviolet light illuminate

Caution

Avoid exposure to the sun

usage

UV dicing tape is appropriate for: glass reducing protection, polishing, grinding, development, slicing process, small place copper foil and PCB slicing process

UV release film product features:

1. After UV curing, the adhesion is very low, and no residue left after removal.
2. Have speedy UV response time, it can enhancing efficiency.
3. Before UV curing it has suitable and dependable adhesion, to defend when cutting.

4. Special structural layout to decrease the influence on the lifestyles of the reducing knife.

Packing:

1. Standard export Paper package.

2. Delivery in 7-15 workdays after deposit confirm

3. Shipping by TNT, UPS ,DHL,FEDEX (IE), Aramex or by air or by sea

4. Loading Port: Shanghai

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