Conductive Foam Tape
Copper foil tape offers excellent thermal conductivity and strong adhesive performance. It enables efficient bonding between electronic components and heat sinks without the need for mechanical fasteners or liquid adhesives. It is widely used for attaching chips, flexible printed circuits (FPC), high-power transistors, heat sinks, and other cooling devices.
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Product Introduction
Products Description
Conductive foam tape is manufactured by applying a chemical plating process to polyurethane foam, giving it excellent electrical conductivity in the X, Y, and Z directions. During production, the original cellular structure and flexibility of the foam substrate are fully preserved, allowing it to be easily laminated with various materials.
The chemical plating technology enables deeper metal penetration into the foam structure, resulting in stronger coating adhesion, more uniform conductivity, and extremely low electrical resistance. Its excellent compression and recovery properties provide outstanding shock absorption performance, helping improve the mechanical impact resistance of electronic devices while effectively filling structural gaps.
The conductive foam can also be laminated with conductive fabric, non-woven fabric, mesh fabric, copper foil, aluminum foil, and other materials to meet different application requirements.
Products Structure
Application
Conductive foam is typically used in applications that requireexcellent conductivity, compressibility, and elasticity to ensure effective electrostaticdischarge and grounding, or to achieve electromagnetic shielding by maintaining asealed enclosure through compression.
Products Series
Compare Properties
Product picture
Basic feature
| Title | Low density series | Medium density series | High density series |
| Description | Density: 18 Kg/m3 The foam is softer with lower rebound force. A very small compressive force can create a larger compression space. |
Density: 30 Kg/m3 Excellent conductivity in X, Y, and Z directions. Outstanding foam compression and recovery performance. |
Density: 45-300 Kg/m3 Excellent high compressibility and high resilience.Ultra-low resistance ensures stable resistanceeven for small-sized products(product design < 5 mm x 5 mm). Foam density can be customized according to customer requirements. |
| Property | Value | Test method |
| Apperance | Gray/black | Gray/black |
| Material | Conductive foam/ conductive sponge | Conductive foam/ conductive sponge |
| Thickness | 0.13mm-20mm | ASTM D 3652 |
| Adhesion | 1.0 kgf/ 25 mm | ASTM D 3330 |
| Surface Resistivity | <0 05Ώ /inch | ASTM F390 |
| Contact Resistance | <0 1Ώ /inch | ASTM F390 |
| Shielding Effectiveness | 70-95db | MIL-DTL-83528E |
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