How durable is the mica board?

After bonding the base material, it is laminated and heat pressed into a laminate. Phenolic laminates have good processability, electrical and mechanical properties, but poor heat resistance. Mainly used for insulation and mechanical parts of mechanical, electrical and electronic equipment.

Compared with phenolic laminates, epoxy resin laminates using phenolic resin or aromatic amine as curing agent have excellent mechanical and electrical properties and higher heat resistance. Micro air gap epoxy resin laminate has fine structure, low water absorption and good performance. Epoxy resin laminate can be used as insulation material for B, F class motors and appliances.

Use mica plate and silicon mica plate to press out two qualified V-rings and install them on the same commutator. The assembly process and parameters are the same. After three dryings, three pressings, and dynamic forming, all the components in the commutator are normal, and the V-ring has no slippage.

According to the above experiments, the reason for the slippage of the V-ring of the diphenyl ether mica board is its low adhesion and poor mechanical properties. Therefore, when the data converter is dry-pressed, its 30-inch surface is subjected to large shear forces, resulting in interlayer cracking and slippage.

Diphenyl ether plastic mica board is made of diphenyl ether resin as adhesive. Although it has good heat resistance, its big disadvantage is brittleness. When subjected to external force, it will only crack. Although the diphenyl resin used in the diphenyl ether plastic mica board has been modified, it is still relatively brittle. Under high stress conditions, it will delaminate and crack, limiting its application in high stress commutator V-rings.