Mica plate stamping process

Once baked, all parts of the mica board commutator are normal. In the second stage of pressure, the commutator components are normal. After the third stage of firing pressure, severe delamination and slippage of the exposed V-rings were found.

During the fabrication and assembly of the three commutators, delamination and displacement of the commutators were found.

After analyzing the reason, we analyzed all the commutators and found that the V-ring was in the middle layer and displaced. At first, we suspected that the partial size of the commutator was not allowed. During the assembly process of the commutator, the V-ring is subjected to uneven shear force, resulting in displacement. But we checked every part and found no problem with dimensional tolerances.

By repeatedly adjusting the pressing process of the V-ring, the gelation time and process of the diphenyl ether plastic mica plate were tested. The gel in the V-ring is fully cured by extending the curing time and increasing the gel content. However, the V-ring pressed by this process is still in the commutator, and there are delamination and slippage phenomena.