What are the lamination process analysis of mica board?
Sep 10, 2022
The lamination process of mica board is epoxy board technology. The lamination process of mica board is an important process of lamination molding. The lamination process is to make the impregnated tape into a slab according to the defined thickness requirements, put it into a polished metal template, and put it on a hot press for heating, pressurization, solidification, cooling, demoulding and post-processing between the two. deal with. template.
(1) Cut the tape. The process is to cut the tape to a certain proportion. The cutting equipment can be a continuous cut-to-length slicer or a process cutting. When cutting tape, be accurate to size. The tapes cut from the epoxy board should be stacked neatly, and the tapes with different glue content and activity should be stacked separately, and the storage records should be kept.
(2) The choice of tape. The tape selection process is very important to the quality of the laminate. If not chosen properly, the laminate will crack and the surface will burn. On the surface of the matching board, 2 tapes with high surface glue content and high fluidity should be placed on each side. The volatile content should not be too large. If the volatile content is too large, the epoxy board should be dried before use.
(3) Hot pressing process. The key to limiting the process is the process parameters, among which the important process parameters are temperature, pressure and time. The epoxy board overcomes the vapor pressure of the volatiles, makes the bonded resin move, and makes the adhesive layer in close contact with the epoxy board; prevents the board from deforming when it cools. The size of the molding pressure depends on the curing characteristics of the resin. 9 MPa epoxy/phenolic laminate and 3.9-5. 9 MPa for epoxy laminate.
(4) Post-processing. The purpose of post-processing is to further cure the resin until it is completely cured, thereby partially eliminating the internal stress of the product and improving the bonding performance of the product. The post-treatment of epoxy board and epoxy/phenolic board is kept at 130-150℃ for about 150 minutes.
