The preparation work before the production of flexible mica plate

The main component of the high temperature resistant mica plate is mica, which is a rock-forming mineral with a hexagonal flake crystal shape. The characteristics are insulation, high temperature resistance, and sericite is widely used in industry, which is widely used in coatings, paints, electrical insulation and other operations. Mica is a general term for the minerals of the mica family. It is an aluminosilicate of metals such as potassium, aluminum, magnesium, iron, and lithium. The crystals are pseudo hexagonal flakes or plates, and occasionally columnar. The lamellar cleavage is very full, vitreous, and the flakes are elastic. The refractive index of mica increases correspondingly with the increase of iron content, from low positive protrusions to medium positive protrusions. The iron-free variant is colorless in the flakes, the higher the iron content, the darker the color, and the increased pleochroism and absorption.

High temperature resistant mica boards and epoxy boards are often used in daily life, but there are great differences between them.

On the base material, epoxy resin glue and glass fiber cloth are selected for epoxy board; mica board (from mica ore) and organic silica gel are selected for mica board.

What they both have in common is high temperature hot pressing.

The high temperature resistant mica board has excellent bending strength and processing performance. Mica board has high flexural strength and excellent resistance. Mica sheets can be processed into various shapes without layering by punching. Excellent environmental protection function, mica board does not contain asbestos, less smoke and less smell when heated, even smokeless and tasteless. Can be widely used in household appliances, metallurgy and chemical industries.

The glass fiber cloth of epoxy board is made by sticking with epoxy resin and heating and pressing. It has high mechanical performance at medium temperature and stable electrical performance at high temperature. Suitable for mechanical, electrical and electronic parts with high marginal structures. It has high mechanical and dielectric properties, excellent heat and humidity resistance. Thermal equivalent f (155°).

The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring-opening polymerization of epoxide in the resin molecule without water or other volatile by-products. Compared with unsaturated polyester resins and phenolic resins, their shortening rate during curing is very low. The cured epoxy resin system has excellent mechanical properties.