Which hardness is higher between mica board and epoxy board?

Muscovite rigid mica board is a high-strength mica board material. The original performance can be maintained when used at high temperature. It is widely used in the following fields: Household appliances: electric irons, hair dryers, toasters, coffee pots, microwave ovens, electric heaters, etc.; Metallurgy and chemical industry: frequency conversion furnace, intermediate frequency furnace, electric arc furnace, injection molding machine, etc.

The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring-opening polymerization in epoxy resin molecules. Does not release water or other volatile by-products. Cured epoxy resin systems have excellent mechanical properties compared to unsaturated polyester resins and phenolic resins. But the overall performance is not as good as mica board.

Epoxy board: Glass fiber cloth is bonded with epoxy resin and heated and pressed. The model number is 3240. It has stable electrical properties at high temperature. Mechanical, electrical and electronic parts for highly insulating structures. It has high mechanical and dielectric properties, good heat resistance and moisture resistance. Heat resistance class F (155 degrees).

Application Features

There are various forms. 

1. A wide variety of resins, curing agents and modifier systems are available to meet application requirements ranging from very low viscosity to high melting point solids.

2. Easy to cure. Using different curing agents, the epoxy resin system can be cured in the range of 0 to 180 °C.

3. The mica board has strong adhesion. The existence of polar hydroxyl and ether bonds in the epoxy resin molecular chain makes it have high adhesion to various substances. Epoxy resin has low shrinkage rate and low internal stress, which helps to improve bond strength.