What are the methods of making soft mica boards?

The wire used in the soft mica board is to press the electric heating alloy material into a sheet, only a few millimeters are needed, and then choose the method of corrosion or laser cutting to make it shape, and then stick the electric heating wire on the mica substrate, and then use die casting. The heating wire is characterized by high temperature resistance and high power density. The local current of the hot wire at the corner is too large, the temperature is too high (up to 500-700 degrees), and the damage and risk are simple. In some manufacturers, a black hole has been burned out of the mica substrate, even posing a fire hazard. The surface of our product is heated, the temperature is uniform, and it does not melt. Since the heating wire is heated linearly, it is difficult to ensure the uniformity of heating. The surface temperature of the heating wire reaches 500 degrees. Therefore, after using for a period of time, the mica heating plate will bake black marks on the surface of the soft mica plate, which affects the appearance.

The process of soft mica board is three drying and three pressing.

The initial drying pressure, the components of the commutator are normal, the secondary drying pressure, the same process as the initial drying pressure is used, and the components of the commutator are normal. After the third drying, it was found that the exposed V-ring of the commutator had serious delamination and sliding. During the subsequent manufacture and installation of the three commutators, delamination and chip evacuation were found in the commutators.

Reason: Analysis of all commutators showed that the centers of the V-rings were misaligned in layers. The initial suspicion is that the standard deviation of a certain part of the commutator is abnormal. When the commutator is installed, the V-ring is subjected to uneven shearing force, resulting in displacement. However, after examining each section, no standard deviation was found.

Repeatedly adjust the bonding process of the V-ring, and test the gelatinization time and process of the soft mica board data. The confinement process was chosen to cure the glue in the V-ring by extending the bake time and increasing the glue content. However, the V-ring constrained by this process still slides in layers in the commutator. Further calculation results of 30° of the motor commutator show that the force per unit area reaches 615kn, but this force is not considered in the structural design.